first, they have not changed the solder...it is still lead free and RoHS compliant - I highly doubt they would have changed the mixture but it's possible
That doesn't mean anything. If course it's Lead free and RoHS compliant, it has to be. There are dozens of blends of solder though that meet those requirements. You have no way of knowing that they changed the compound. And what I mentioned was the heat profile used, this is much more important then the type of solder alone.
second, the gluing DOES NOT help/prevent the CPU/GPU from lifting off the board (if it did, why am I repairing boards with 3RL and glue? - yes I understand 3RL can be multiple "things" but i'll touch on this in a sec)
Because glue alone can't stop the problem. That doesn't mean it's not a good solution or a good thing to do.
third, the "new" GPU heatsink does absolutely nothing - it actually cuts a whooping .2 degrees off the temp
that's amazing !!...that's right not even a degree - and theres have been 2 accurate separate test by different people to agree
This is the third time I've asked you not to post that, it's complete bull$#!t. You can't back it up i've never seen a link or a picture or anythign showing this so called "proof". Just reference to a forum in another language.
Quite frankly you're a fool if you believe that. There is no way to know for sure WHAT i can do without measureing the GPU temperature with a thermister IN the GPU core. Sticking an IR thermometer at the base of the chip and measuring heat in an OPEN 360 does nothing.
The new Heatsink design not only uses a differnt grade of aluminum (it's denser) - it has a better finish on the base of it, AND it moves the heat out of the GPU airstream into the CPU airstream where there is signifigantly more airflow.
EVEN IF the core temperature doesn't drop much with the new heatsink, THAT'S NOT WHAT IS IMPORTANT. What's important is that it moves the heat AWAY from the area of the GPU and into the airstream. Therefore keeping the board and surrounding components themselves, colder, helping to reduce board warpage.
I'll say it again, microsoft is obviously all about saving money in the hardware design, they would not have come up with this solution without testing to show it was working and needed.
fourth, the cpu and gpu (depending on your board) are 65nm...not 60 - though you are right in that they do consume less power and produce less heat - though not enough to prevent 3RL WITH glue as there was a vid of a (iirc) Elite box with 3RL on maxconsole
1. Run your console vertical, thereby blocking it's largest vent
2. Run it with high ambient room heat
3. Run it in a dusty enviroment
4. Run it in too confined of a space
Those alone will greatly increase the chances of the RRoD and can make any generation do it.
fith, there are too many design flaws for the 3RL issue to go away or be reduced like M$ hope
While there ARE multiple design issues, they have been signifigantly reduced in newer consoles. The factory cooling solutions etc are much more suitable with the more efficent and cooler running 60 nm core'd chips, and will be even more so with 45 nm chips should they release them.
It should be also noted that M$ could fix the problem almost entirely with engineering minimal effort, but due to it being a lesser issue now, it's not in their best interest.