Strange. Earlier you were defending the X-clamps and now you seem to be saying that you replace them, to prevent the board warping. Sounds much like what Team Hybrid's fix aims to do. I like your idea of using thermal pads to transfer heat from the bottom of the board to the case though.
What do you mean by "once the board is damaged enough"? Do you just mean once it's warped quite a bit?
I was indeed defending the XCLAM design.
But after the board has been damaged enough they're more trouble than the solution.
So for you to understand, I'll explain what happen in the months after someone buy the console until it RRoDs:
Assume that player1 who is a student uses his console in a daily basis for eight hours, during his vacations. And the other player "player2" (which works) only uses two hours and not every day.
Player1 turns his console on 8AM and plays until midday then turns it off to go lunch. At the time it was turned on the ambient temperature was somewhere around 20 degrees Celsius which rose to 65 degrees Celsius within five minutes of Gears of War2 game play.
Player2 turns his console 8AM and plays one hour of Gears of war 2 and his system heat up the same as player1's system.
Player1 get back and turns on his system again and plays for five more hours then turn it off. Next day Player1 plays three hours at morning and four at night.
At the third day Player1's system main board will have been exposed to mechanical stress four times (from power on/off heating and cooling) while player2 system had been stressed only once.
I noticed that some people who never power off their 360 have them last much longer than people who turn them on and off all the time.
Back on what I meant, once a 360 has broken down, it will need the clamp mod. But if you don't allow it to "cook" the GPU and motherboard while it's new, it won't break down and xclamp will be fine.
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are you sure you want to do that ? you better fix that box for homebrew. 
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